Ultra-Slim design, 0.4mm pitch, 0.8mm stack heigh.Stable Contact performance and a better feel for mating.

  High power capability up to 100A per pin; low power up to 65A per pin, ideal for demanding current requirements  Ultra-low board height of 11.40mm, perfectly suited for 1U/2U power supplies or distribution systems  High-ventilation structure design enhances heat dissipation, ensuring stable system operation  Halogen-free materials meeting international environmental standards  Wide operating temperature range: -40℃ to +125℃, supporting extreme environments  Available in right-angle male and female connectors; straight versions are under development for coplanar and backplane applications  Customizable number and placement of power and signal contacts to meet specific customer needs  Offers both solder and press-fit board mounting options for flexible implementation

High Power: Supports OCP ORV3, 48 V high current.Thermistor Integration:    Real-time connector temperature monitoringPolarity Color Coding: Red (+), Black (–) for easy identificationMultiple Configurations: Cable, braided, and solid busbar versionsCustomization Options: Wire type, AWG, length, busbar dimensions

Ultra-Slim, 0.35mm pitch, 0.70mm stack height.Buckle terminal structure for high contact performance and a better feel for mating.Fixed power pin design to achieve 5.0A high current flow.